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Tag: JFM

Automotive device test solution

Peripheral package IC test socket

Posted on 2017年1月13日2024年1月5日

JF Microtechnology offers a range of test sockets for various lead / leadless packages that emphasize OEE (equipment overall efficiency) in IC / LSI production. It adopts its own contact pin and housing structure and covers a wide range from evaluation to mass production such as high current / Kelvin test and high frequency analog […]

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